AMD has announced additions to its 3rd Gen EPYC processor range that use 3D die stacking and are capable of delivering a performance uplift of up to 66% across a variety of technical computing workloads when compared to non-stacked versions.
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Featuring AMD 3D V-Cache technology, the new processors – also known by their codename of ‘Milan-X’ – are built on the “Zen 3” core architecture. Designed for use in data centre servers, they are the first to make use of 3D die stacking and also feature the industry’s largest L3 cache.
AMD says that they will deliver outstanding performance for specific technical computing workloads such as computational fluid dynamics, finite element analysis, electronic design automation, and structural analysis. These are critical design tools for companies involved in areas such as car, cycle and aircraft design, where there is a need to model and simulate the complexities of the physical world.
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